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PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
June 2006
RMPA1966 i-LoTM
WCDMA Band II Power Amplifier Module, 1850-1910 MHz
Features
40% WCDMA efficiency at +28.5dBm Pout 20% WCDMA efficiency (58mA total current) at
General Description
The RMPA1966 Power Amplifier Module (PAM) is Fairchild's latest innovation in 50 matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA1966 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16dBm), where the handset most often operates. A simple two-state Vmode control is all that is needed to reduce operating current by more than 60% at 16dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power-saving methods. No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier efficiency. Further, the 4 x 4 x 1.0 mm LCC package is pin-compatible and a drop-in replacement for last generation 4 x 4 mm PAMs widely used today, minimizing the design time to apply this performance-enhancing technology. The multi-stage GaAs Microwave Monolithic Integrated Circuit (MMIC) is manufactured using Fairchild RF's InGaP Heterojunction Bipolar Transistor (HBT) process.
+16dBm Pout
Low quiescent current (Iccq): 18mA in low-power
mode
Meets UMTS/WCDMA performance requirements Meets HSDPA performance requirements Single positive-supply operation with low power and
shutdown modes - 3.4V typical Vcc operation - Low Vref (2.85V) compatible with advanced handset chipsets Compact Lead-free compliant LCC package - (4.0 x 4.0 x 1.0mm nominal) Industry standard pinout Internally matched to 50 and DC blocked RF input/output
Functional Block Diagram
(Top View) MMIC
Vcc1 1 RF IN GND Vmode Vref
10 Vcc2
INPUT MATCH OUTPUT MATCH BIAS/MODE SWITCH
2 3 4 5
9 GND 8 RF OUT 7 GND 6 GND
11 (paddle ground on package bottom)
(c)2005 Fairchild Semiconductor Corporation
1
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RMPA1966 i-LoTM Rev. B
PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
Absolute Maximum Ratings1
Symbol
Vcc1, Vcc2 Vref Vmode Pin Tstg Supply Voltages Reference Voltage Power Control Voltage RF Input Power Storage Temperature
Parameter
Value
5.0 2.6 to 3.5 3.5 +10 -55 to +150
Units
V V V dBm C
Note: 1. No permanent damage with one parameter set at extreme limit. Other parameters set to typical values.
Electrical Characteristics1
Symbol Parameter Min
1850 28 20 28.5 16 40 20 520 58
Typ
Max
1910
Units
MHz dB dB dBm dBm % % mA mA
Comments
f Operating Frequency CDMA/WCDMA Operation Gp Power Gain Po PAEd Linear Output Power
PAEd (digital) @ +28.5dBm PAEd (digital) @ +16dBm Itot High Power Total Current Low Power Total Current WCDMA Adjacent Channel Leakage Ratio ACLR1 ACLR2 5.00MHz Offset 10.00MHz Offset
-40 -40 -55 -55 2.0:1 4 -139 -40 -55 -60 10:1 85 18 4.5 1 2.5:1
dBc dBc dBc dBc
Po=+28.5dBm; Vmode=0V Po=+16dBm; Vmode2.0V Vmode=0V Vmode2.0V Vmode=0V Vmode2.0V Po=+28.5dBm, Vmode=0V Po=+16dBm, Vmode2.0V WCDMA Modulation 3GPP 3.2 03-00 DPCCH +1 DCDCH Po=+28.5dBm; Vmode=0V Po=+16dBm; Vmode2.0V Po=+28.5dBm; Vmode=0V Po=+16dBm; Vmode2.0V
General Characteristics VSWR Input Impedance NF Noise Figure Rx No Receive Band Noise Power 2fo 3fo-5fo S Harmonic Suppression Harmonic Suppression Spurious Outputs2,3 -30
dB dBm/Hz dBc dBc dBc C mA mA A
Po+28.5dBm; 1930 to 1990MHz Po+28.5dBm Po+28.5dBm Load VSWR 5.0:1 No permanent damage.
Ruggedness w/ Load Mismatch3 Tc Case Operating Temperature DC Characteristics Iccq Quiescent Current Iref Reference Current Icc(off) Shutdown Leakage Current
5
Vmode2.0V Po+28.5dBm No applied RF signal
Notes: 1. All parameters met at Tc = +25C, Vcc = +3.4V, Vref = 2.85V and load VSWR 1.2:1, unless otherwise noted. 2. All phase angles. 3. Guaranteed by design.
RMPA1966 i-LoTM Rev. B
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PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
Recommended Operating Conditions
Symbol
f Vcc1, Vcc2 Vref Supply Voltage Reference Voltage (Operating) (Shutdown) Bias Control Voltage (Low-Power) (High-Power) Linear Output Power (High-Power) (Low-Power) Case Operating Temperature -30
Parameter
Operating Frequency
Min
1850 3.0 2.7 0 1.8 0
Typ
3.4 2.85
Max
1910 4.2 3.1 0.5 3.0 0.5 +28.5
Units
MHz V V V V V dBm dBm C
Vmode
2.0
Pout
+16 +85
Tc
DC Turn-On Sequence
1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16dBm) Low-Power: Vmode = 2V (Pout < 16dBm)
RMPA1966 i-LoTM Rev. B
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PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
Evaluation Board Layout
1 5 6 3 6 5
2
1966
XYTT
Z
4
7 5
Materials List
Qty
1 2 5 Ref 3 3 2 1 1 A/R A/R
Item No.
1 2 3 4 5 5 (Alt) 6 7 7 (Alt) 8 9
Part Number
G657553-1 V2 #142-0701-841 #2340-5211TN GRM39X7R102K50V ECJ-1VB1H102K C3216X5R1A335M GRM39Y5V104Z16V ECJ-1VB1C104K SN63 SN96 PC Board
Description
SMA Connector Terminals Assembly, RMPA1966 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3F Capacitor (1206) 0.1F Capacitor (0603) 0.1F Capacitor (0603) Solder Paste Solder Paste
Vendor
Fairchild Johnson 3M Fairchild Murata Panasonic TDK Murata Panasonic Indium Corp. Indium Corp.
Evaluation Board Schematic
3.3 F Vcc1 SMA1 RF IN 50 Ohm TRL 1000 pF
1 2 4
1000 pF
10
3.3 F Vcc2 50 Ohm TRL
1966
XYTT
8
SMA2 RF OUT
Z
Vmode Vref 1000 pF
5 11
3,6, 7,9
0.1 F
(package base)
RMPA1966 i-LoTM Rev. B
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PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
Package Outline
I/O 1 INDICATOR TOP VIEW 1 2 10 9
1966
XYTT
(4.00mm +.100 ) SQUARE -.050
3 4 5
8
6
1.1mm MAX. FRONT VIEW .25mm TYP. 3.50mm TYP. See Detail A .40mm .30mm TYP. .85mm TYP. 11 2 1 1.08mm 1.84mm BOTTOM VIEW .18mm DETAIL A. TYP. 3.65mm .10mm .10mm .40mm .45mm
Signal Descriptions
Pin #
1 2 3 4 5 6 7 8 9 10 11
Signal Name
Vcc1 RF In GND Vmode Vref GND GND RF Out GND Vcc2 GND
Description
Supply Voltage to Input Stage RF Input Signal Ground High Power/Low Power Mode Control Reference Voltage Ground Ground RF Output Signal Ground Supply Voltage to Output Stage Paddle Ground
RMPA1966 i-LoTM Rev. B
5
ZT T XY 9 6 6
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1
Z
7
PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE. Precautions to Avoid Permanent Device Damage: * Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices should remain in their original packaging until component placement to ensure no contamination or damage to RF, DC and ground contact areas. * Device Cleaning: Standard board cleaning techniques should not present device problems provided that the boards are properly dried to remove solvents or water residues. * Static Sensitivity: Follow ESD precautions to protect against ESD damage: - A properly grounded static-dissipative surface on which to place devices. - Static-dissipative floor or mat. - A properly grounded conductive wrist strap for each person to wear while handling devices. * General Handling: Handle the package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoiding damaging the RF, DC, and ground contacts on the package bottom. Do not apply excessive pressure to the top of the lid. * Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition, devices are protected and require no special storage conditions. Once the sealed bag has been opened, devices should be stored in a dry nitrogen environment. Device Usage: Fairchild recommends the following procedures prior to assembly. * Assemble the devices within 7 days of removal from the dry pack. * During the 7-day period, the devices must be stored in an environment of less than 60% relative humidity and a maximum temperature of 30C * If the 7-day period or the environmental conditions have been exceeded, then the dry-bake procedure, at 125C for 24 hours minimum, must be performed. Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. Reflow Profile * Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A maximum heating rate is 3C/sec. * Pre-heat/soak: The soak temperature stage serves two purposes; the flux is activated and the board and devices achieve a uniform temperature. The recommended soak condition is: 60-180 seconds at 150-200C. * Reflow Zone: If the temperature is too high, then devices may be damaged by mechanical stress due to thermal mismatch or there may be problems due to excessive solder oxidation. Excessive time at temperature can enhance the formation of inter-metallic compounds at the lead/board interface and may lead to early mechanical failure of the joint. Reflow must occur prior to the flux being completely driven off. The duration of peak reflow temperature should not exceed 20 seconds. Soldering temperatures should be in the range 255-260C, with a maximum limit of 260C. * Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock. However, rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of the heat sink to the PWB. The solder joint should be 95% void-free and be a consistent thickness. Rework Considerations: Rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no more than 5 seconds. No more than 2 rework operations should be performed.
Recommended Solder Reflow Profile
260
Ramp-Up Rate 3 C/sec max
Peak temp 260 +0/-5 C 10 - 20 sec
Temperature (C)
217 200
Time above liquidus temp 60 - 150 sec
150
Preheat, 150 to 200 C 60 - 180 sec
100
Ramp-Up Rate 3 C/sec max
50 25
Time 25 C/sec to peak temp 6 minutes max
Ramp-Down Rate 6 C/sec max
Time (Sec)
RMPA1966 i-LoTM Rev. B
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PRELIMINARY
RMPA1966 i-LoTM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST(R) FASTrTM ActiveArrayTM FPSTM BottomlessTM FRFETTM Build it NowTM GlobalOptoisolatorTM CoolFETTM GTOTM CROSSVOLTTM HiSeCTM DOMETM I2CTM EcoSPARKTM 2 i-LoTM E CMOSTM ImpliedDisconnectTM EnSignaTM IntelliMAXTM FACTTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UniFETTM UltraFET(R) VCXTM WireTM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDiS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILDiS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I19
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
RMPA1966 i-LoTM Rev. B
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